Overview
Devices in this category are designed to be used as building blocks for three level systems looking to optimize system size and layout flexibility.
Key Features
- Low inductance packaging.
- Engineered from the ground up to be used to realize a variety of three level topologies.
- Low loss Mitsubishi Electric IGBT and Diode power chips inside.
Specifications
| Rated Voltage (Vces)/(Vds) | 1700 |
|---|---|
| Rated Current (Ices)/(Ids) | 800 |
| Viso (Vrms) | 4000 |
| Connection Type | Dual |
| Package Type | 32 |
| Package/Dimensions (mm) | 62 x 108 |
