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Devices in this category are designed to be used as building blocks for three level systems looking to optimize system size and layout flexibility.

Key Features

  • Low inductance packaging.
  • Engineered from the ground up to be used to realize a variety of three level topologies.
  • Low loss Mitsubishi Electric IGBT and Diode power chips inside.


Rated Voltage (Vces)/(Vds) 1700
Rated Current (Ices)/(Ids) 600
Viso (Vrms) 4000
Connection Type Dual
Package Type 32
Package/Dimensions (mm) 62 x 108
RoHS Compliant UL Compliant