Devices in this category are designed to be used as building blocks for three level systems looking to optimize system size and layout flexibility.
- Low inductance packaging.
- Engineered from the ground up to be used to realize a variety of three level topologies.
- Low loss Mitsubishi Electric IGBT and Diode power chips inside.
|Rated Voltage (Vces)/(Vds)||1200|
|Rated Current (Ices)/(Ids)||1400|
|Package/Dimensions (mm)||67 x 130|