Overview
Devices in this category are designed to be used as building blocks for three level systems looking to optimize system size and layout flexibility.
Key Features
- Low inductance packaging.
- Engineered from the ground up to be used to realize a variety of three level topologies.
- Low loss Mitsubishi Electric IGBT and Diode power chips inside.
Specifications
| Rated Voltage (Vces)/(Vds) | 3300 |
|---|---|
| Rated Current (Ices)/(Ids) | 1200 |
| Viso (Vrms) | 10.2k |
| Connection Type | Dual |
| Package Type | 140 x 130 IHM |
| Package/Dimensions (mm) | 140 x 130 |
