Devices in this category are designed to be used as building blocks for three level systems looking to optimize system size and layout flexibility.
- Low inductance packaging.
- Engineered from the ground up to be used to realize a variety of three level topologies.
- Low loss Mitsubishi Electric IGBT and Diode power chips inside.
|Rated Voltage (Vces)/(Vds)||1200|
|Rated Current (Ices)/(Ids)||400|
|Connection Type||Dual - AC Switch|
|Package Type||Standard Type|
|Package/Dimensions (mm)||80 x 110|