Mitsubishi Electric offers a wide power module lineup that contributes to energy savings and high reliability for industrial equipment. This T-Series device offers low power loss, improved reliability, and simplifies the inverter design process.
- Low Loss Mitsubishi Electric 7th generation CSTBT™ IGBT and RFC Diode technology
- High reliability and long thermal cycle lifetime due to Thick Metal Substrate (TMS) package technology which eliminates the typical large substrate solder layer, a common point of failure.
- Industry Standard Pin Out and Footprint.
- Improved package inductance through ultrasonic terminal bonding and internal bus lamination.
|Rated Voltage (Vces)/(Vds)||1200|
|Rated Current (Ices)/(Ids)||100|
|Package Type||Standard Type|
|Package/Dimensions (mm)||34 x 94|