Overview
Mitsubishi Electric's Hybrid SiC power modules have improved power loss reduction through optimized IGBT and Diode configuration
Key Features
- SiC-MOSFET built in power module
- Contributes to a reduction in system power loss through optimized IGBT and Diode 3-Level T-Type internal circuit
- Reduction in surge voltage due to low inductance package
Specifications
| Rated Voltage (Vces)/(Vds) | 1200 |
|---|---|
| Rated Current (Ices)/(Ids) | 600 |
| Viso (Vrms) | 4000 |
| Connection Type | 3 Level T-Type |
| Package Type | DX-L |
| Package/Dimensions (mm) | 152 × 121.7 |
